Thermal Management for High-Power LED Array

Problem Statement

A 200W LED array generates significant heat in a compact lighting fixture. Design a passive or hybrid cooling solution that maintains LED junction temperature below 85°C in ambient temperatures up to 40°C.

Requirements

• LED junction temperature < 85°C
• Ambient operating temperature: 0-40°C
• Thermal resistance: < 0.2°C/W
• Include thermal simulation results
• Consider manufacturability and cost

Constraints

• Maximum heatsink volume: 150mm × 150mm × 80mm
• Passive cooling preferred (active cooling allowed if justified)
• Aluminum or copper materials
• Must allow IP65 sealing of enclosure
• Weight limit: 1.5kg

Deliverables

• CAD model (STEP)
• Thermal simulation report (ANSYS, SolidWorks Flow, or similar)
• Manufacturing drawings
• Cost analysis