Modular Electronics Enclosure System

Problem Statement

Design a family of modular enclosures for IoT sensor nodes. The system should allow different configurations (wall-mount, DIN rail, standalone) using common base components.

Requirements

• Tool-free assembly with snap-fit joints
• Accommodate PCBs up to 100mm × 80mm
• Cable entry points with strain relief
• Transparent window option for status LEDs
• Achieve IP54 rating minimum

Constraints

• ABS or PC/ABS material
• Injection molding process
• Base size: approximately 110mm × 90mm × 40mm
• Target cost: < $5 per unit at 5,000 quantity

Deliverables

• STEP files for base and all mounting variants
• Draft and moldflow analysis
• Assembly instructions
• BOM with material specifications